FEATURES
- Designed to Meet Class 1
Division 1
- Purged pressure switch
- NEMA 4X (IP66) sealed enclosure
- Water proof and dust proof
- Stainless steel construction
- Easy latch access
- Hard-anodized aluminum
heat sink
- Closed loop thermal cooling
for high heat environments
- Flexible mounting options
- Optional Non-Incendive
Keyboard/Mouse
CONTACT
HEADQUARTERS
11529 Sun Belt Ct.
Baton Rouge, Louisiana 70809
Phone
800.223.8050
International 001.225.298.0300
Fax
225.297.2440
E-mail
sales@vartechsystems.com
Website
www.vartechsystems.com
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Material Specifications
Regulator Body
Zinc w/ Enamel Finish
Regulator Handle
Polycarbonate
Enclosure Pressure Gauge
Alum. w/ Enamel Finish
Tube Fittings
316 SS Forged Body
Tubing
316 SS 1/4" .035 Welded
System Nameplates
Silk screened Lexan® & SS
Fastener Hardware
SS Screws & Bolts
Mounting Plate
316 14 Ga #3 Brush SS
EPCU Enclosed Body
Bead Blast Cast Alum.
Enclosure Warning
Nameplate
Silkscreened SS
Lexan® is a registered trademark of the
General Electric Company.
The VT750ESC is a NEMA 4X HMI system designed to meet Class 1, Div 1 protection. The purge system uses an automatic pressure switch to automatically trigger alarms in case of pressure loss.
Durable
The VT750ESC can easily handle the punishment of harsh computing environments. They are proven tough in real world applications such as industrial production areas, outdoor kiosks and public terminals.
The VT750ESC chassis has no external vents, so nothing can get under its skin, including dust, dirt, moisture, oil, chemicals or other harsh contaminants.
A hard-anodized aluminum heat exchanger and internal heat management system keep it cool in environments where ambient temperatures approach 60°C -- without using outside air.
Easy Access
VT750ESC is designed with easy maintenance and up-grades in mind. A latched panel provides simple access to this NEMA 4X HMI system. With its moderate weight and dimensions, VT750ESC enables flexible mounting options.
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Display
17", 1280 x 1024 SXGA
Processor
T4500 2.30 GHz 800MHz FSB Intel Dual Core
BIOS
Phoenix-Award 16Mbit (SPI) with RPL/PXE
LAN Boot ROM, SmartView and customer
CMOS backup
O/S
Windows XP Professional
(optional Windows Embedded Standard or Windows 7)
System Memory
2 DDR2 533/667 SDRAM sockets, 2 GB
standard, 4 GB optional (~3.25
recognizable)
Graphics
Intel® GME965 GMCH Gen 4 Integrated
graphics engine
LAN
Integrated Intel Gigabit PCI Express LAN Chip
Hard Drive
500 GB Fast Access SATA drive
Power Input
12 VDC Optional:12/24 VDC AC by available
brick, 6 to 32V DC
Power Connector
Standard Power Inlet (IEC320 C14)
Power Consumption
40W max
Dimensions
20" W x 18" D x 11" H
PCI Expansion Slots
Optional PCI Express, Optional 1 or 2 32 bit
DVD Drive (E-IDE / ATAPI)
DVD Drive (E-IDE / ATAPI)
DVD-R, DVD+R, DVD-RW, DVD+RW, DVD-R
DL, DVD+R9, CD-R, CD-RW
I/O Ports
Back - 3 RS-232 COM port (Optional RS-422\485 port), 2 LAN ports, 4 USB 2.0, 2 Audio jacks
Front - 2 USB 2.0
Firewire Ports
2 x IEEE 1394a
Enclosure
Lockable door
NEMA 4X (IP66), 316 stainless steel
Anodized aluminum heat sink
Keyboard/Mouse (Optional)
Industrial silicone rubber keyboard
with integrated pointing device
Environmental/Thermal
NEMA 4X (IP66)
waterproof and dust proof
Temperature
Operational: 41°F to 140°F/5°C to 60°C,
Storage: -40°F to 149°F/-40°C to 65°C
Humidity
Operational: 10 ~ 80% (relative; non condensing)
Enclosure
Easy-open, lockable door
NEMA 4X (IP66), 316 stainless steel
Anodized aluminum heat sink
Construction
316 stainless steel
Anodized aluminum heat sink
10" handles
IP66 - NEMA 4X (IP66), waterproof and dustproof
Dimensions
Enclosure Only:
18" H x 20" W x 11" D
66 lb
Purge Kit Only:
20” (H) x 11” (W) x 10.5” (D), 38 lb
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Purge System Mounting to Side (L/R), Top or Bottom
Windows Embedded Standard or Windows 7
Optional PCI Express, Optional 1 or 2 32 bit PCI Slots
Optional RS-422\485 port
Keyboard/Mouse
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Purge System w/ Pressure Switch (Class 1, Div 1 Protection)
This Rapid Exchange® purging system operates on a supply of
compressed instrument air or inert gas. It regulates and monitors pressure
within sealed (protected) enclosure(s), in order to prevent combustible
dust accumulation or remove and prevent flammable gas or vapor
accumulations. The system accomplishes four air exchanges and maintains
a “safe” (0.25”) pressure. The system includes an Electrical Power Control
Unit (EPCU) that monitors system operation and controls enclosure power.
All start-up requirements must be satisfied before the EPCU will energize
power to the enclosure(s). These processes reduce the hazardous
(classified) area rating within the enclosure(s), in accordance with the NEC
- NFPA 70, Article 500, NFPA 496 and ISA 12.4.
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Weight
38lb
Temperature Range
-20F to 120F
Supply Pressure Range
5 - 120 psi
Supply reguirements
Clean air or inert gas
Safe Pressure Setpoint
.25” / 1.0”
Safe Pressure Flow Rate
0.1 - 3.5 SCFH - Enclosure integrity determines actual flow rate
Safe Pressure Flow Rate
4 SCFM / 240 SCFH - With regulator
set to 60 psi min. during exchange
Exchange Time
As required - Time required to exchange 4 volumes within the enclosure(s), based on actual measured safe pressure flow rate or 5 minutes,
whichever is greater
System Supply Port
1/4" tube fitting
Enclosure Supply Fitting
1/4"
tube fitting
Enclosure Reference Fitting
1/4" tube fitting
EPCU Conduit Port Size
1/2" FPT
EPCU Power Requirements
120 VAC 60Hz 10
EPCU Power Consumption
500mA
Dimensions
20" (H) x 11" (W) x 10.5" (D)
Height & Width dimensions reflect
mounting plate measurements. Depth
dimensions reflects overall easurement of
system, including components.
Mounting
Side (L/R), Top or Bottom
OPERATION
In accordance with system instructions, start-up requires air supply to be engaged
and EPCU power to be energized. The system must perform an exchange cycle
(determined by the safe pressure flow rate — 5 minutes minimum) before power
can be energized. Loss of safe pressure causes the EPCU to de-energize power to the protected enclosure(s). The purge system includes an explosion proof
differential pressure switch with form “C” contacts for audible of visual alarm
systems.