VT950ESW: 19.0" Enclosed Purged Workstation for Class 1 Division 1 Environments

17” NEMA 4X (IP66)  Remote Monitor - for Class 1 Div 1 Environments

FEATURES
- Designed to Meet Class 1, Div 1
- Purge with automatic
pressure system
- Water Proof
- Dust Proof
- Corrosion Resistant
- Extreme Temperature Proof
- Shock and Vibration Proof
- Built-in NEMA 4x Keyboard
with pointing device
- Easy-access Interior
- Intrinsically Safe Keyboard
and Pointing Device

CONTACT

HEADQUARTERS
11529 Sun Belt Ct.
Baton Rouge, Louisiana  70809

Phone
800.223.8050
International 001.225.298.0300
Fax
225.297.2440

E-mail
sales@vartechsystems.com

Website
www.vartechsystems.com

 

 


_____________________

Purge System w/ Pressure Switch (Class 1, Div 1 Protection)

Regulator Body
Zinc w/ Enamel Finish

Regulator Handle & Bowl
Polycarbonate

Rapid Exchange Gauge
Poly Case & Brass Tube

Rapid Exchange Solenoid
Brass w/ Enamel Finish

Tube Fittings & Valves
316 SS Forged Body

Tubing
316 SS 1/4” .035 Welded

System Nameplates
Silk screened Lexan® & SS

Fastener Hardware
SS Screws & Bolts

Mounting Plate
316 14 Ga #3 Brush SS

EPCU Enclosed Body
Bead Blast Cast Alum.
Conduit & Fittings
Galvanized Steel

Enclosure Warning
Nameplate

Silkscreened SS
Lexan® is a registered trademark of the
General Electric Company.

The VT950ESW is a NEMA 4X system designed to meet Class 1, Div 1
protection. The purge system uses an automatic pressure switch to
automatically trigger alarms in case of pressure loss.
Ideal for extreme environments, the VT950ESW industrial computer and its
predecessors are currently in use in coal mines, rock quarries, oil rigs, chemical
manufacturing plants and production floors which are located in Class 1,
Division 1 environments. The VT950ESW is engineered for extremely rugged
conditions, both indoors and out.

Product Features

Video
19" active matrix TFT LCD display, 350 nits (cd/m2), 1280 x 1024 SXGA

Processor
T4500 2.30 GHz 800MHz FSB Intel Dual Core

BIOS
Award PnP 4MB Flash ROM BIOS

O/S
Windows XP Professional (optional Windows Embedded Standard)

System Memory
SO-DIMM DDRII 667/533/400 2 GB

Chip Set
Intel® GME965+ICH8M/EM

VGA
Intel ®GME965 GMCH Gen4 integrated
graphics engine

Hard Drive
500 GB SATA High Performance

PCI Expansion
Optional PCI Express
Optional 1 or 2 32 bit PCI Slots

Power Input
100-240VAC 1.5A 50/60 HZ

Power Connector
Standard Power Inlet (IEC320 C14)

Dimensions
20" W x 18" D x 11" H
DVD Drive (E-IDE / ATAPI)
DVD-R, DVD+R, DVD-RW, DVD+RW, DVDR
DL, DVD+R9, CD-R, CD-RW

I/O Ports
2 RS-232 COM port
(Optional RS-422\485 port)
2 LAN ports
6 USB 2.0
2 Audio jacks
Firewire Ports
2 x IEEE 1394a

Enclosure
Lockable door
NEMA 4X (IP66), 316 stainless steel
Anodized aluminum heat sink

Keyboard/Mouse
Industrial silicone rubber keyboard
with integrated pointing device

Environmental/Thermal
NEMA 4X (IP66)
waterproof and dust proof
-20°C to 55°C (-4° to 131°F)

Construction
Enclosure Only:
20" H x 24" W x 17" D, ~ 75 lb
Purge Kit Only:
22" (H) x 11" (W) x 13.75" (D), 47 lb

Product Options

Purge System Mounting to Side (L/R), Top or Bottom

Windows Embedded Standard

_____________________________________________________________

Purge System w/ Pressure Switch (Class 1, Div 1 Protection)

This Rapid Exchange® purging system operates on a supply of
compressed instrument air or inert gas. It regulates and monitors pressure
within sealed (protected) enclosure(s), in order to remove and prevent
flammable gas or vapor accumulations. The system accomplishes four air
exchanges and maintains a "safe" (0.25") pressure. The system includes
an Electrical Power Control Unit (EPCU) that monitors system operation
and controls enclosure power. All start-up requirements must be satisfied
before the EPCU will energize power to the enclosure(s). These processes
reduce the hazardous (classified) area rating within the enclosure(s), in
accordance with the NEC - NFPA 70, Article 500, NFPA 496 and ISA 12.4.

Product Features

Weight
47lb

Temp. Range
-20F to 120F

Supply Pressure Range
80 - 120 psi

Capacity & Filtration
1.5 oz @ 20 Micron

Supply requirements
Clean air or inert gas

Safe Pressure Setpoint
.25” @ safe pressure

Safe Pressure Flow Rate
0.1 - 3.5 SCFH - Enclosure integrity
determines actual flow rate

Exchange Pressure
3" - 5"

Exchange Flow Rate
4 SCFM / 240 SCFH - With regulator
set to 60 psi min. during exchange

Exchange Time
1min/ft3

System Supply Port
1/4" FPT

Enclosure Supply Fitting
1/4" tube fitting

Enclosure Reference Fitting
1/4" tube fitting

EPCU Conduit Port Size
1/2" FPT

EPCU Power Requirements
120 VAC 60Hz 10

EPCU Power Consumption
500mA

Dimensions
22" (H) x 11" (W) x 13.75" (D)
Height & Width dimensions reflect
mounting plate measurements. Depth
dimensions reflects overall
measurement of system, including
components.

Mounting
Side (L/R), Top or Bottom

OPERATION

In accordance with system instructions, start-up requires air supply to be engaged
and EPCU power to be energized. The enclosure protection vent must be tested and the enclosure(s) must be sealed. The EPCU power control switch must be activated and the system will self test. The enclosure pressure valve is then used to manually set a safe reading on the enclosure pressure indicator. When safe pressure is stable, the Rapid Exchange® control valve is fully engaged. Upon completion of the Rapid Exchange® cycle, (5 minutes minimum) the Rapid Exchange® control valve automatically disengages. Pressure returns to a safe setting and enclosure power is energized. Loss of safe pressure causes the EPCU to de-energize power to the protected enclosure(s). The purge system includes an explosion proof differential pressure switch with form “C” contacts for audible of visual alarm systems.


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